High-Speed Layout Design
We provide turnkey PCB solution starting from Library Development, Schematic Drafting, Layout, Analysis, Validation to Quick Turn Prototyping. In the past 10 years in the industry with 30+ layout experts, we have been supporting more than 200+ customers worldwide for many complex designs with critical timelines and lot of technical challenges. We constantly improve our technology capabilities to meet the industry needs with respect to cost, speed, reliability and performance.
- HDI, Microvias, Blind/Buried Vias
- Flex & Flex-Rigid Boards
- Fiber Channel (SFP+, QSF), DDRx
- 1/10G Line Card, USB, Bluetooth
- SERDES, XAUI, SRIO, GPS, RF & Microwave
- USB, SATA, HDMI, SAS3, NVMe
- HDD/SSD, SAS Expanders
- PCIe, LXI, VXI, VME
- Switch / Matrix Cards, Digital IO Cards
- QPI/UPI, DMI, QSGMII, SGMII
- DDR2/3/4, RLDRAM, QDR, LPDDR
- High Vg / Ct, RTD, Break Out Box
- DFX Analysis(DFM, DFA, DFT, etc.)
- PCB Reverse Engineering
- Complies with IPC 2221, 2222
Technology Expertise
- Ethernet Over Backplane
- Fiber Channel (SFP+, QSF) , DDRx
- 1/10G Line Card, USB, Bluetooth, WiFi
- SERDES, XAUI, SRIO, GPS, RF & Microwave
- USB, SATA, HDMI, SAS3, NVMe, HDD/SSD, SAS expanders
- PCIe Switches/Controllers, PCIe add-on
- PXIe, LXI, VXI, VME, High Vg / Ct, RTD
- Switch / Matrix Cards, Digital I/O Cards, Backplanes, Break Out Box
- QPI/UPI, PCIE, DMI, QSGMII, SGMII
- DDR4/3/2, RLDRAM, QDR, LPDDR
- PCI Express, PCI Express 2.0, PCI Express 3.0
- Handled Up to 100 GBps
Design Capabilities
- Feasibility Analysis for Product Miniaturization
- Database Library Development & Maintenance
- Highspeed Stack Up Building Support
- Constraints Driven Schematic Drafting
- Controlled Impedance Design
- Highspeed/High density/Highly Constrained Designs
- HDI, VIP, Back Drill, Blind and Buried vias
- Design for DFM/DFA/DFT
- Concurrent/Express Design Support
- On-site or Offshore Design Support
- Process Oriented Design Execution
Industry Application
- Semiconductor
- Automotive
- Industrial Electronics
- Telecommunication
- Mobile Communication
- Defense
- Aerospace
- Consumer Electronics
